Chaque semaine NAE vous propose une veille technologique sur une thématique de sa feuille de route technologique.
Aujourd’hui retrouvez sa veille sur la thématique Fiabilité électronique qui abordera :
- Transphorm to make new type of gallium nitride epi wafers in the US
Source : www.eenewspower.com – 2019-08-02
Lire la suite - Frequency- and Temperature-Dependent Gate Reliability of Schottky-Type p -GaN Gate HEMTs
Source : www.scopus.com – 2019-08-01
Lire la suite - The Effect of Carrier Gas and Reactor Pressure on Gallium Nitride Growth in MOCVD Manufacturing Process
Source : www.scopus.com – 2019-08-01
Lire la suite - Mechanical Reliability of Thick Films for High-Temperature Packaging
Source : ieeexplore.ieee.org – 2019-07-22
Lire la suite - Thermal shock reliability of GaN die-attached on DBA with Ag sinter paste
Source : ieeexplore.ieee.org – 2019-07-21
Lire la suite - Modelling Thermo-Mechanical Stress in GaN-LEDs Soldered on Copper Substrate with Simulations Validated by Raman Experiments
Source : ieeexplore.ieee.org – 2019-07-21
Lire la suite - Simulative Comparison of Polymer and Ceramic Encapsulation on SiC-MOSFET Power Modules under Thermomechanical Load
Source : ieeexplore.ieee.org – 2019-07-21
Lire la suite - Packaging Solution For GaN On Silicon Power Devices
Source : powerelectronicsworld.net – 2019-07-09
Lire la suite - Functional Printing Market Advanced Technologies and Innovations 2015-2025 – Wiki Times
Source : www.wikitimes.co.uk – 2019-07-08
Lire la suite - Système de commande de grille pour modules à double alimentation IGBT et SiC | Power Integrations
Source : www.vipress.net – 2019-07-03
Lire la suite - Conductive Inks: Power Electronics, EMI Shielding, In-Mold Electronics
Source : www.idtechex.com – 2019-07-03
Lire la suite - Antennas for Emerging 5G Systems
Source : www.hindawi.com – 2019-07-01
Lire la suite - A new method for an old topic: Efficient and reliable estimation of material bulk modulus
Source : www.scopus.com – 2019-07-01
Lire la suite
