Wide bandgap (WBG) power semiconductors are being adopted into mainstream designs due to order-of-magnitude improvements in electrical figures-of-merit (FOMs). These huge performance improvements require revisiting many design assumptions, including thermal management [1].
This article discusses the challenges that thermal management raises due to increased power density, especially with chip-scale-packaging (CSP). What is sometimes overlooked, however, is that CSP eGaN® power FETs and integrated circuits have excellent thermal performance when mounted on standard printed circuit boards (PCBs) with simple methods for attaching heat sinks.
Source : Understanding Thermal Management of Chip-Scale GaN Devices – Technical Articles
