For various pulsed power electronics like, metal oxide semiconductor field-effect transistor (MOSFET), insulating gate bipolar transistor (IGBT), Gate turn-off thyristor (GTO), Integrated gate-commutated thyristor (IGCT), heat loads are often in the range of 10W/cm2...
This work describes the development of a single phase water-cooled microfluidic heat exchanger for cooling very high heat flux electronics. The heat sink was designed for a unique additive manufacturing process capable of manufacturing millimeter-scale metallic parts...
A broadband aperture-coupled magneto-electric (ME) dipole antenna array designed for metallic additive manufacturing (AM) is proposed. The proposed array antenna that operates in Ka-band consists of four radiating elements, a power divider and a flange for connecting...
L’E-Fan X ne décollera pas. Victime de la crise mondiale du coronavirus, le programme a été arrêté. Airbus et Rolls-Royce ont conjointement décidé de mettre fin au démonstrateur technologique, qui a néanmoins permis de glaner plusieurs briques technologiques et...
Three GaN switches from Power Integrations support 75W power supply adapter designs without a heatsink. Previous devices supported 55W designs.The three InnoSwitch3-MX isolated switcher chips work with the InnoMux controller for higher efficiency 75W power supplies...
